Amkor Technology, Inc. (AMKR) Analyst/Investor Day May 21, 2026 9:00 AM EDT
Company Participants
Jennifer Jue – Vice President of Investor Relations & Finance
Kevin Engel – CEO, President & Director
Farshad Haghighi – Executive VP & Chief Sales Officer
Doug Scott
Megan Faust – Executive VP, CFO & Treasurer
Conference Call Participants
James Schneider – Goldman Sachs Group, Inc., Research Division
Steve Barger – KeyBanc Capital Markets Inc., Research Division
Yu Shi – Needham & Company, LLC, Research Division
Ian Lieberman – Talos Eurisko Asset Management LP
Sahej Singh – Stifel, Nicolaus & Company, Incorporated, Research Division
Presentation
Operator
Ladies and gentlemen, welcome to the stage Vice President of Investor Relations, Jennifer Jue.
Jennifer Jue
Vice President of Investor Relations & Finance
Good morning, everyone. Welcome to Amkor’s 2026 Investor Day. Thank you for joining us here in person and online. Before we begin, please note the safe harbor statement on the screen. Today’s presentation includes forward-looking statements that are subject to risks and uncertainties, and we may reference non-GAAP financial measures. Reconciliations and additional disclosures are available in our SEC filings as well as on our website. We have an exciting agenda plan for you today, designed to be a forward-looking discussion on how the semiconductor industry is evolving, and how Amkor is positioning itself to drive long-term shareholder value.
We’ll discuss our strategy across deeper customer partnerships, technology leadership and an intentionally built global footprint. You’ll hear from several members of our management team this morning. Our President and CEO, Kevin Engel, will begin by framing the industry context and Amkor’s strategy to lead the next era of advanced packaging; Farshad Haghighi, our Chief Sales Officer will then discuss how customer engagement is evolving as we enhance strategic partnerships in key markets; Doug Scott, our advanced and mainstream technology leader, will walk through how we are elevating technology leadership with advanced packaging.


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