Samsung Electronics Stock Surges to Record Highs on AI Memory Boom, HBM4 Shipments Drive Gains

Samsung Electronics Co. shares have rallied sharply in early 2026, hitting all-time highs near 200,000 won as explosive demand for AI-related memory chips propels the South Korean tech giant’s recovery and positions it as a key player in the global semiconductor supply chain.

As of February 24, 2026, Samsung (005930.KS) closed at 200,000 won, up 3.63% on the day and marking a fresh peak after climbing from around 193,000 won in recent sessions. The stock has surged more than 60% year-to-date, reflecting a dramatic turnaround fueled by record quarterly profits and aggressive advances in high-bandwidth memory (HBM) technology critical for AI accelerators.

The momentum accelerated following Samsung’s announcement in February that it had begun mass production and commercial shipments of its industry-first HBM4 chips. The sixth-generation HBM delivers consistent transfer speeds of 11.7 Gbps—up 22% from its HBM3E predecessor—with potential peaks at 13 Gbps, addressing data bottlenecks in AI computing. Samsung highlighted improved power efficiency and secure process technology, with plans to deliver HBM4E samples in the second half of 2026.

Analysts view the HBM4 rollout as a pivotal step for Samsung to regain ground in the high-margin AI memory market, where it had lagged rivals like SK Hynix. The company anticipates HBM sales to more than triple in 2026 compared to 2025, with capacity expansions underway to meet surging orders from major clients, including those building Nvidia-powered AI infrastructure.

This optimism stems from Samsung’s blockbuster fourth-quarter and full-year 2025 results, released January 29, 2026. The company posted record quarterly revenue of 93.8 trillion won (about $65.45 billion), up 9% quarter-on-quarter and 24% year-over-year. Operating profit soared to an all-time high of 20.1 trillion won, more than tripling from the prior year and surpassing analyst expectations. For the full fiscal year, revenue reached 333.6 trillion won, up 11%, while operating profit stood at 43.6 trillion won.

The Device Solutions (DS) division, encompassing semiconductors, drove the performance with quarterly revenue of 44.0 trillion won and operating profit of 16.4 trillion won. Memory profitability improved dramatically amid a global shortage of high-value AI chips, particularly HBM used in Nvidia GPUs and other accelerators. Management attributed the surge to strong demand from hyperscalers investing heavily in AI data centers.

Despite challenges in other segments, such as seasonal softness in home appliances and mobile devices due to trade conditions, the DS strength more than offset declines elsewhere. Currency tailwinds from a stronger U.S. dollar added roughly 1.6 trillion won to operating profit.

Samsung’s push into advanced memory extends beyond HBM4. The company showcased LPDDR6 developments at the International Solid-State Circuits Conference (ISSCC) 2026, achieving transfer speeds up to 14.4 Gbps—a 35% improvement over LPDDR5X—targeting power-efficient solutions for AI-enabled mobile and edge devices. Mass production for LPDDR6 is expected in the second half of 2026.

Investors have rewarded the progress. Samsung shares jumped as much as 7.6% following the HBM4 shipment news, renewing all-time highs. The stock’s valuation reflects renewed confidence in Samsung’s ability to capitalize on AI infrastructure spending, projected to reach hundreds of billions across Big Tech in 2026.

Wall Street and Seoul analysts remain largely bullish. Consensus targets suggest further upside, with some firms highlighting Samsung’s diversified portfolio—spanning smartphones, displays, foundries, and consumer electronics—as a buffer against sector-specific risks. The company’s foundry utilization rebounded above 80% in early 2026, driven by HBM4 base die production on 4nm processes and orders for Exynos mobile processors.

Competition remains fierce. SK Hynix has led in HBM market share, supplying Nvidia extensively, while Micron pushes aggressively. Reports indicate HBM4 capacity is sold out for 2026 across major suppliers, with long-term agreements locking in demand. Samsung’s pricing strategy—potentially 20-30% higher for next-gen products—could boost margins if sustained.

Broader industry dynamics support the rally. AI demand has diverted manufacturing capacity toward HBM, squeezing supply for standard DRAM and creating shortages that benefit incumbents. TrendForce estimates HBM will consume 23% of total DRAM wafer output in 2026, up from 19% in 2025, with global HBM demand growing 70% year-over-year.

Samsung’s upcoming Galaxy Unpacked event on February 25, 2026, in San Francisco adds another layer of anticipation. The company is expected to unveil the Galaxy S26 series, potentially integrating advanced AI features powered by its memory expertise.

Looking ahead, Samsung guided for continued semiconductor strength in 2026, with conservative capex in 2025 shifting to increased memory investments. Executives emphasized building comprehensive AI leadership through ethical, high-performance solutions.

While risks persist—geopolitical tensions, supply chain disruptions, and potential AI spending slowdowns—the current trajectory points to sustained momentum. Samsung’s disciplined execution in fixing earlier HBM qualification issues and scaling production has transformed it from laggard to contender in the AI chip race.

For investors, the stock’s climb underscores a broader theme: companies mastering AI-enabling technologies stand to benefit most in the ongoing digital transformation. Samsung Electronics, once challenged by memory market cycles, now appears well-positioned to ride the AI wave into 2026 and beyond.